The mistakes can be both technical design flaws or operational flaws in the controls put in place in the assembly process. Below are the top five mistakes that you should look out for in PCB assembly:
On the technical side, flex-cracking refers to excessive bending of the PCB under a ceramic chip capacitor. The ceramic chip capacitor cannot withstand excessive stress due to its brittle nature. For adequate electrical performance, some printed circuit boards will require large capacitors. Stress on the capacitor can result from accidental dropping or placement of excessive weight on it at any stage of PCB assembly. The type of ceramic chip capacitor that you use in the design stage should be able to handle the stress of assembly and it should not easily crack. You could respond to issues on flex-cracking by using a shorter capacitor or you could replace the capacitor with a smaller unit which has the same capacitance and voltage.
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