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Industry NewsNews > Industry News > PCBA test methods    

PCBA test methods

Hits:1  Add Date:2020/11/13

<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">1. Manualvisual inspection

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">Visualinspection can be performed at each step of the PCBA process. Manual visualinspection of PCBA assembly is the most primitive method in PCBA qualityinspection. It only USES eyes and magnifying glass to check the welding of PCBAboard's circuit and electronic components, such as welding mode, whether thewelding spot is brided, whether there is insufficient welding and whether thereis incomplete welding. Magnifying glass is the base tool for visual inspection,and metal pins can be used to check for welding imperfections on IC leads.

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">2. Onlinetester (ICT)

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">On-linetester is widely used in PCBA processing industry for its excellent test andinspection performance. ICT can almost identify welding and component problemsin PCBA. It has high speed and high stability. The electrical probe tests thefilled printed circuit board (PCB) and checks for short circuit, open circuit,resistance, capacitance, and other basic quantities to indicate whether thecomponent is manufactured correctly.

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">3. AutomaticOptical Detection (AOI)

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">Automaticoptical detection is a non - contact testing method. Automatic opticaldetection plays an important role in inspection. Automatic optical detection isan automatic visual inspection during the manufacture of printed circuit boards,in which the camera automatically scans the PCBA board under test forcatastrophic failures (such as missing components) and quality defects (such asrounded dimensions or shapes or component deflections).

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">4. Automaticoptical detection (AXI)

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">With thewidespread use of BGA and CSP, typical detection methods such as ICT cannotcheck the embedded solder joints of the component. AXI can test misalignment,missing balls and solder deposits. AXI USES X-rays to travel through solidobjects to capture their images. It can be divided into two types: 2D and 3D.

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">5. Functionalcircuit testing

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">Thefunctional circuit test is the last test before the PCBA product is launched.Unlike other tests, such as AOI, AXI, and ICT, FCT aims to make the UUT (unitunder test) work in a simulated environment and use output data to check itsactual performance.

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">6. Sampleinspection

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">Prior to massproduction and assembly, PCB manufacturers and assemblers usually conduct afirst sample inspection to check that SMT equipment is properly prepared sothat vacuum nozzles or alignment problems can be avoided during massproduction, resulting in PCBA board production problems. This is referred to asa first piece inspection.

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">7. Flyingneedle tester

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">Flying needleprobe is suitable for high complexity PCB inspection which requires expensiveinspection cost. The design and inspection of flying needles can be completedin a day and the assembly cost is relatively low. It can check the opencircuit, short circuit and direction of components mounted on a PCB. Inaddition, it does a good job of identifying component layout and alignment.

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">8.(Manufacturing Defect Analyzer, MDA)

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<span lang="EN-US" style=""font-size:18.0pt;font-family:"Segoe UI",sans-serif;">The purposeof MDA is simply to visually test the board to reveal a manufacturing defect.Since most manufacturing defects are simple connectivity problems, MDA islimited to measurement continuity. Typically, the tester will be able to detectthe presence of resistance, capacitance, and transistors. Protective diodes canalso be used to detect integrated circuits to indicate whether components areproperly placed.

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